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ACS759xCB
Thermally Enhanced, Fully Integrated, Hall Effect-Based
Linear Current Sensor IC
With 100 μ Ω Current Conductor and Optimized Performance at 3.3 V
Package CB, 5-pin package, leadform PFF
0.5
R1
R3
14.0±0.2
0.5 B
5
3.0±0.2
4
4.0±0.2
1.50±0.10
1o±2°
R2
3
4
21.4
A
3.5±0.2
0.8
17.5±0.2
1.5
13.00±0.10
1.91
4.40±0.10
Branded
Face
2.9±0.2
5o±5°
B
PCB Layout Reference View
NNNNNNN
TTT - AAA
0.381 –0.030
1
2
3
+0.060
10.00±0.10
3.5±0.2
LLLLLLL
YYWW
1
7.00±0.10
C Standard Branding Reference View
N = Device part number
T = Temperature code
A = Amperage range
L = Lot number
0.51±0.10
1.9±0.2
Y = Last two digits of year of manufacture
W = Week of manufacture
= Supplier emblem
For Reference Only; not for tooling use (reference DWG-9111, DWG-9110)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exactcaseandleadconfigurationatsupplierdiscretionwithinlimitsshown
A Dambar removal intrusion
B Perimeter through-holes recommended
C Branding scale and appearance at supplier discretion
Creepage distance, current terminals to signal pins: 7.25 mm
Clearance distance, current terminals to signal pins: 7.25 mm
Package mass: 4.63 g typical
17
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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